EPUSIL EP 1140 DV
Very High Thermal Conductivity Epoxy Adhesive
DESCRIPTION
Epusil EP 1140 DV
is a two component, highly filled, epoxy adhesive,
EP 1140 DV perform excellent electrical properties,
very high thermal conductivity with very low thermal
expansion. EP 1140 DV has high adhesion strength to
metals, ceramics, and many sorts of plastics. EP
1140 DV perform high chemical resistance properties.
A special hardener can be used in order to flexibly
the system.
PROPERTIES - UNCURED
EP 1140
EPC 911 EPC 264
Color,
visual.............................……….
Black
Viscosity, @ 250)………………………
Soft paste
Specific Gravity
………………............ 2.3
Mix Ratio (weight)
............................... --
100:4-5 100:7.2-7.5
Mix Viscosity, (@ 250).
………………. --
Soft past Soft paste
Gel Time @ 250
C (1 mm layer.)..…….. --
2 hour 5-6
hours
Shelf Life @ 250C
(months) …............... 12
min
12 min 12 min.
PROPERTIES - CURED
PHYSICAL
Hardness,
ASTM-D-2240 (Durometer) Shore D ..……
85-90 85-90
Bond Shear
Strength, (Al/Al) (kg/cm2)
…………….... 180 175
Flexural Strength,
ASTM-D-790……………………. . 11500 psi
13000 psi
Coefficient of
Thermal Expansion (cm/cm/0C)...……..
27 * 10-6 24 * 10-6
Working
temperature.......................………………….
-40 - 1000C -40 - 1500C
Chemical
Resistance …………………………………
Good Excellent
ELECTRICAL
Dielectric Strength,
ASTM D-149 (volts/mil) ……
475 500
Dielectric Constant,
ASTM -D- 150 ……………..
6.3 6.5
Volume Resistivity,
ASTM -D- 257 (ohm-cm) …. 1.3 X
1016 1.1 X 1016
Thermal
Conductivity……………………………..
1.44 W/m0c 1.44 W/m0c
Note:
Some more hardeners like EPC 11 or EPC 124 can be
used in combination with the a/m adhesive in order
to achieve different properties. For more details,
contact Polymer Gvulot customer assistance
department.
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