EPUSIL EP 950 DV
Heat and Fast Cure, One Component
Epoxy Adhesive
Epusil EP 950 DV
is a unique one component thixotropic epoxy
adhesive.
EP 950 DV formulated
specially for the encapsulation of delicate
semi-conductor bonding assemblies, and is
non-corrosive to silicone and aluminum. EP 950 DV
has excellent flow properties, resettling good
penetration between bonded wires. It form nicely
rounded glob tops, and has limited spread properties
due to its thixotropic properties. EP 950 DV has
excellent adherence to P.C. Board and high
resistance to humidity.
TYPICAL UNCURED
PROPERTIES
Color
.............................................................
Black
Viscosity (spindle 7 & 10 RPM) @ 250
.....… 50000 - 70000 cps
(spindle 7 & 10 RAM) @ 400
..…. 25000 - 35000 cps
Density (gr./cm3)
...........................................
1.19
Shelf life (
RT )
.............................................
6 month (at least)
TYPICAL CURED PROPERTIES
Hardness ( Shore D)
.....................................
85
Tensile lap shear strength (Al/Al) (kg/cm2)..
220
Elongation ( % )
(bulk)................................
1.5-2
Shrinkage ( %
) ............................................
< 0.7
TYPICAL ELECTRICAL
PROPERTIES
Volume Resistivity
(ohm-cm)....................... 1.9
* 1014
Dissipation Factor @ 250C ......... 1
kHz....... 0.008
10 kHz .... 0.10
100 kHz... 0.13
Dielectric Constant @ 250C
..... 1 kHz ..... 4.97
10 kHz..... 4.92
100 kHz .. 4.83
Curing Process ………… 1000
C..... 20-25 min.
or 1100 C...... 10-15 min.
or 1200 C........
5-10 min.
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