EPUSIL EP GP 20
Semi rigid adhesive for general purposes
DESCRIPTION
Epusil EP-GP 20 is a two component, semi rigid epoxy
glue displaying excellent adhesion
to metals and ceramics. The Epusil EP GP 20 has
thermal shock resistance over a medium range of
temperatures and its flexibility avoids any
deformation between the adhesive articles.
PROPERTIES - UNCURED
EP GP 20
EPC GP 20
Color, visual
............................
clear Clear,
yellow
Specific Gravity, g/cm3
............ 1.15 +/-
0.02 1.1 +/- 0.03
Viscosity, cps @ 250 C
............
12000-14000 25000-35000
Mix Ratio, (Weight)
...............
1:1
Set time @ 250 C ,
min............
20
Curing Time 1 mm thickness @ 250C
3-4 hrs.
Final curing Time .@ 250C
….
7 days
Shelf Life, months...............….
12 ` 12
PROPERTIES CURED
Test Methods
Limits
Tensile lap shear, Al/Al, kg/cm2............
ASTM-D-1002 185-205
Tensile lap shear, st/st, kg/cm2..............
215-235
Service Temperature. (0C).....................
ASTM-D-794 -20 to +80
Hardness, Shore D
...............................
ASTM-D-2240 63-68
Izod Impact (J/cm)
..............................
ASTM-D-226 7
Dielectric Strength kV/mm,
.................
ASTM-D-149 18
Volume resistivity,
Ohm-cm...................
ASTM-D-257 1014
Flexibility
..............................................
Semi rigid
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