EPUSIL EP 109
Equal Ratio, Medium
Viscosity, Non-abrasive
Epoxy Potting and Casting Compound
DESCRIPTION
Epusil EP 109 is an
easy-to-use, equal ratio, medium viscosity epoxy
potting/casting compound, designed for protecting
electronic components and systems. Epusil EP 109
features excellent electrical and physical
properties.
PROPERTIES - Uncured
Part A
Part B
Color, Visual
................................... Brown
Off white
Viscosity, ASTM
-D-2393 (cps) .....
11000-13000 20000 - 30000
Specific Gravity (gr/cm3
@ 250).......
1.4+/-0.05
Mix Ratio ( by
weight) .....................
100 :100
Mix Viscosity,
ASTM-D-2393 (cps).
22000-30000
Pot Life (100 gr @
250C) min..........
180-220
Shelf Life @ 250
C (months)............... 12
PROPERTIES – CURED
Physical
Hardness,
ASTM-D-2240 (Shore D ).............
65 - 72
Tensile Strength,
ASTM-D-638 ......................
160-165 kg/cm2
Tensile Elongation,
ASTM-D-638 .................. 18-20%
Compressive
Strength, ASTM-D-695 .............
300-315 kg/cm2
Coefficient of
Thermal Expansion (cm/cm/0C)
12 X 10-5
Electrical
Dielectric Strength, ASTM-D-149 (volt/mil)..
. 375
Dielectric Constant, ASTM-D-150 (60 Hz))
.... 5
Dissipation Factor, ASTM-D-150 (60 Hz)
...... 0.07
Volume Resistivity, ASTM-D-257 (ohm/cm)
.. 6 * 1014
Thermal Conductivity, W/ m0c
....…………….. 0.5 W/ m 0C
MIXING INSTRUCTION
1.
Pre-mix content of each container before use.
2.
Weigh out equal parts of each component and mix
together thoroughly. Be careful to scrape sides and
bottom of each container to incorporate all unmixed,
or serious loss of physical and electrical
properties will result
3.
De-air (if necessary) at 0.5 cm. Hg for 10 minute.
4.
Pour into cavity or mold.
5.
Re-cover both containers immediately after each use,
as deterioration can result.
CURE
SCHEDULE
Allow curing at room temperature for 24 hours. 2-3
hours then 600C and 1 to 2 hours at 900C
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