|
EPUSIL EP 502 MD
Equal
Ratio, Low Viscosity, Non-abrasive Epoxy Potting and
Casting Compound
DESCRIPTION
Epusil EP 502 MD is an easy-to-use, equal ratio, low
viscosity epoxy potting/casting compound, designed
for production dispensing equipment in protecting
electronic components and systems. Epusil EP 502 MD
features good electrical and physical properties.
PROPERTIES -
Uncured
Part
A Part B
Color,
Visual .............................…...
Black Amber
Viscosity, ASTM -D-2393 (cps) …...
13000-15000 200-300
Specific Gravity ...................…........
1.08
Mix Ratio
(weight) ...............…........
100 100
Mix
Viscosity, ASTM-D-2393 (cps)..
3000-3500
Pot Life (100 gr @ 250C)
min..…..... 50-60
Shelf Life @ 250
C (months).....….... 12
PROPERTIES -
Cured
Physical
Hardness, ASTM-D-2240 (Shore A)...........
80-90
Tensile Strength, ASTM-D-638
.................. 6500 psi
Tensile Elongation, ASTM-D-638
............... 5-7%
Coefficient of
Thermal Expansion (cm/cm/0C). 45X10-6
Electrical
Dielectric Strength, ASTM-D-149 (volt/mil)
...... 425
Dielectric Constant, ASTM-D-150 (60 Hz)) ...…
3.8
Dissipation
Factor, ASTM-D-150 (60 Hz) .......... 0.038
Volume Resistivity, ASTM-D-257 (ohm/cm) .…..
6X1014
Thermal Conductivity, W / m0C
....…………….... 0.2
MIXING INSTRUCTION
1.
Pre-mix content of each container before use
uniformity.
2.
Measure out equal parts of each component and mix
together thoroughly. Be
careful to scrape sides and bottom of each container to incorporate all
unmixed material, or serious loss of physical and
electrical properties will result.
3.
De-air (if necessary) at 0.5 cm. Hg for 10 minute.
4.
Pour into cavity or mold.
5.
Re-cover both containers immediately after each use,
as deterioration can result.
CURE SCHEDULE
Allow curing at room temperature. To accelerate
cure, allow three hours at room temperature, then 600C
for 3-4 hours
Printable version |
