EPUSIL RTV 111
General Purpose
RTV Silicone Sealant/Encapsulant
DESCRIPTION
Epusil RTV 111 is a multi-purpose casting material
for use as an encapsulant, sealant-potting compound.
Epusil RTV 111 has been used successfully in
protecting electronic components, assemblies and
delicate systems. Epusil RTV 111 exhibits excellent
electrical properties, low temperature flexibility
and high temperature stability. A variety of
catalysts are available for different cure
situations.
PROPERTIES – UNCURED
Color,
visual............................……....
White
Viscosity,
ASTM-D-1084 ……….….. 9000 -
11000 c.p.s
Specific Gravity
…………..........……. 1.18+/-
0.02
Mix Ratio (RTV Cat
12)............……..
0.1-0.5 by weight
Mix
Viscosity…………………….…… 8500 -
10000 c.p.s
Pot Life @ 250
C …………………….. 1 to 4 hours
Shelf Life @ 250
C. …………………… 6 months min.
PROPERTIES - CURED
Physical
Hardness,
ASTM-D-2240 (Durometer)………..
Shore A 45
Tensile Strength, ASTM
D-412……………….. 350 p.s.i.
Tensile Elongation, ASTM
D-412…………….. 190%
Tear Strength, ASTM-D-624 (Die B
1b./in.)…. 15
Coefficient of
Thermal Expansion (cm/cm/0C).
25 *10-5
Service
Temperature…………………………… -550C
to 2040C
Shrinkage
……………………………………… 0.2% to 0.5%
Electrical
Dielectric Strength,
ASTM D-149 (volts/mil)…
500
Dielectric Constant,
ASTM -D- 150 (60 Hz)…. 3.5
Dissipation Factor, ASTM -D- 150 (60
Hz)…. 0.019
Volume Resistivity,
ASTM -D- 257 (ohm-cm). 1 * 1015
Thermal
Conductivity (W/m0C)………………
0.29
MIXING INSTRUCTION
1.
Weigh out required amount of Epusil RTV 111.
2.
Measure the required amount of catalyst.
3.
Mix thoroughly, scraping both the bottom and sides
of the mixing container.
4.
Evacuate mixture @ 29 in Hg for 3-4 minutes to
insure a void-free casting.
5.
Pour into unit, cavity or mold.
CURE SCHDULE
Overnight at room temperature (12-16 hours) @ 25
0C. Faster tack-free surfaces achieved
using varied catalysts.
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